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The use of CAD "MAX + plus II" for the development of digital devices on FPGAs from Altera
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Metrology notes
Despite the variety of generally accepted tests, recently their results have often added confusion than to clarify the essence of the phenomena. There are tests that allow you to measure…

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Cold shower for a hot friend

So, we have established that the task of cooling the processor should be solved regardless of how the other elements are cooled. And the ways to solve it have long been known, let me just briefly dwell on some points.

To cool the processor, it is necessary and in most cases it is enough to install a radiator on the processor, and a fan on the radiator.The quality of the processor cooling is determined primarily by the properties of the heatsink. The radiator is characterized by almost only three parameters:

material of which the radiator is made;
contact between the heatsink and the processor (thermal interface properties);
surface area of ​​the radiator.
New Russians can afford the luxury of using sterling silver radiators. Silver is really the best material for making radiators. The best in all respects, except for the price. Therefore, we, “poor Ukrainians,” are better suited for aluminum radiators. Of course, they are inferior in quality to silver, but for modern processors, their quality, as a rule, is quite enough. An intermediate position is occupied by copper radiators. Copper has almost the same thermal conductivity as silver, but it costs significantly less. However, copper is much worse than aluminum, treatable, and therefore the cost of a copper radiator is much higher than the cost of aluminum. In addition, the copper radiator is much heavier than aluminum. Thus, today the most widespread and possessing all the properties we need is an aluminum radiator.

Nevertheless, for the most modern processors it is already difficult to make an aluminum radiator. For Intel Pentium IV processors, a combined heatsink is used: the base is made of copper, and the cooling fins are made of aluminum.

Only such a heatsink can handle the task of cooling the Intel Pentium IV processor. This radiator is very expensive and heavy. Not everyone will be able to budge a computer with an Intel Pentium IV processor (however, sometimes this can be a positive feature of a computer).

You can, of course, find many shortcomings with such a radiator. But bearing in mind that the amount of heat released depends only on the processor’s performance, we should assume that AMD “will not remain in debt.” There is every reason to believe that at the beginning of the next millennium it is combined radiators that will be most widely used.

An important effect on the temperature of the processor is provided by the quality of the thermal contact of the heatsink with the processor. No matter how we press the heatsink to the processor, there is always an air gap between them. The reason for this is the microscopic roughnesses of the surfaces of both the processor and the radiator. Air conducts heat quite disgustingly. Therefore, some substance is introduced into the space between the processor and the radiator, which can fill in irregularities and more or less conductively heat (this is the thermal interface). Many versions of the thermal interface are known: thermal paste, thermal mixtures, heat-conducting gaskets, adhesive films. Most often, we may encounter heat-conducting adhesive films and thermal grease.

A heat-conducting adhesive film is a thin film (most often aluminum foil) coated on both sides with an adhesive substance with the addition of a filler that conducts heat well. For modern radiators, such a film is glued to the radiator at the factory.

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